Through Silicon Vias (TSVs) are the foundation of the 3D-IC revolution and are a key enabler for extending semiconductor integration trends into a new phase. Integrated Device Manufacturers and fabless design houses need small, high-density, unobtrusive vias for improved signal integrity and Si real-estate availability.
TSVs cannot be manufactured with acceptable yield/cost using traditional dry processes for liner, barrier and seed deposition. Chemical and Physical Vapor Deposition techniques show basic shortcomings and impose high capital investments, holding back the industry-wide adoption of 3D-IC solutions.
Electrografting (eG™) is a molecular engineering technology delivering high-quality films for high-aspect ratio TSVs at a reduced cost as compared to conventional dry methods. Electrografting generates surface-initiated conformal films which are thin, continuous, adherent and uniform. It is a wet-process technique, operated in standard, widely available plating tools.
Alchimer has recently announced the release of AquiVia XS, a seedless metallization technology which eliminates one of three metallization steps allowing TSVs to be manufactured at an even lower cost than previously possible. Cost-of-ownership analysis for a typical 5 x 50 µm TSV shows an 80 percent improvement over the traditional dry process stack.
Latest news
Alchimer will be exhibiting at Semicon WEST 2010, July 13 to 15 in San Francisco, South Hall booth number #1811. Please contact us to make an appointment to meet at the show, or just call by our booth.
July 12th 2010
Alchimer Receives Equity Investment From Panasonic Corporation
June 22nd 2010
AquiVia Fill Sets New Standards for Metallization Process
Of the Most Advanced Through-Silicon Vias
April 7th 2010
Bill Bottoms, Veteran Chip Industry Executive, Investor and Entrepreneur Joins Alchimer Board
