Enabling technology for economical advancement of semiconductor manufacturing
Alchimer creates and markets innovative chemical formulations and processes for the deposition of nanometric coatings on semiconductor wafers. You can buy the formulations from us or license them, together with our process IP.
Our electrochemical technology, Electrografting (eG™), enables the construction of high aspect ratio (>10:1) through silicon vias (TSVs) for 3D IC packaging and can half the cost of processing wafers for this application, compared with using dry (CVD or PVD) processes. Electrografting can also be used to produce reliable, consistent, copper interconnects, even at 45 nm node and beyond.
Applications engineers are available worldwide to provide on-site or on-line support for qualification. Environmental, health and safety specialists assist our customers in the safe use and handling of Alchimer products. Customer service is at the very heart of our business.
Alchimer also offers state-of-the-art Analytical Services. For more information please visit our Analysis Lab page or contact us at info@alchimer.com.
Latest news
Alchimer will be exhibiting at Semicon WEST 2009, July 14 to 16 in San Francisco, North Hall booth number 5950. Please contact us to make an appointment to meet at the show, or just call by our booth.
June 23nd 2009
Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development
June 17th 2009
Alchimer a finalist for “Best of West” award
June 10th 2009
Alchimer's Enhanced eG ViaCoat Achieves up to 80 Percent Reduction
In Cost of Ownership for TSV Copper Seed
May 29th 2009
Alchimer presented a paper at ECTC 2009 in San Diego: Electrografted Seed Layers for Metallization of Deep TSV Structures.
May 14th 2009
Alchimer CTO Dr. Claudio Truzzi has been invited to speak at the 7th Annual MEPTEC MEMS Symposium, "MEMS Innovation – Growth Engine In Rich and Lean Times" conference to be held on Thursday, May 14 at the Wyndham hotel in San Jose
