Electrografting

A breakthrough molecular-engineering technology that dramatically reduces costs and increases yields in 3D IC and on-chip interconnects.

3D TSV products

For cost effective, high aspect ratio – up to 20:1 – through-silicon vias that will help drive IC performance.

Dual Damascene products

For wet processes that excel at dual damascene’s Cu seed layer and fill steps, because they easily deposit uniform films over complex topographies