Enabling technology for economical advancement of semiconductor manufacturing
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films to create copper interconnects in semiconductor interconnects and through silicon vias for 3D packaging.
The company’s breakthrough technology, Electrografting (eG™), is an electrochemical-based process that enables the growth of nanometric films, of various types, on both conducting and semiconducting surfaces.
Electrografting enables the metallization of high aspect ratio (18:1) Through Silicon Vias (TSVs) for 3D IC packaging while cutting the cost of processing wafers by 62 percent, compared with using dry processes (CVD and PVD). Electrografting can also be used to produce reliable copper interconnects for the 45 nm node and beyond.
Applications engineers are available worldwide to provide on-site or on-line support for qualification. Customer service is at the very heart of our business.
Alchimer also offers state-of-the-art Analytical Services. For more information please visit our Analysis Lab page or contact us at info@alchimer.com.
Latest news
February 4th 2010
Alchimer Signs Far-Reaching Agreement with KPM Tech, South Korean Chemical and Equipment Manufacturer
December 2nd 2009
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process
