Every electronic device, from microprocessors to circuit boards to photovoltaic panels, is built around interconnects – wiring structures that convey power and data.

Today, the most advanced of these structures are produced using vapor-phase deposition processes (such as PVD and CVD). But these costly and complex approaches are running into fundamental limitations, most notably in their ability to reliably coat nano-scale 3D structures. Poor yield and rising costs place these legacy technologies in direct tension with the economic and business needs of the electronics sector.

Alchimer’s deposition technology is engineered at the molecular level for high performance at much lower cost – typically 60 percent less than PVD. The Electrografting (eG™) and Chemicalgrafting (cG™) processes produce outstanding conformal coatings even over complex structures, using economical industry-standard process equipment.