Articles
January, 2012
SST Cover Story – Metallization processes for standardized wide-IO memory applications (page 10 of the document)
November 2011
i-Micronews - Better deposition for better interconnects: going beyond the limits of legacy processes (page 5 and 6 of the document)
September 2011
ElectroniqueS – Alchimer parie sur les TSV et l'interconnexion 3D
August 7, 2011
Electro IQ - IFTLE 60 Semicon 2011: ASE, Alchimer, SPTS
July – August 2011
Chip Scale Review - Alchimer Technology Breakthrough targets Silicon Interposer Applications (page 16)
July 21, 2011
SST podcast and article - Via-last 3D packaging and interposer metallization costs chat
July 27, 2011
SST - SEMICON West 2011: New product roundup
June 7, 2011
EE Times - Betting on liquid TSV processes for 3D integration
May / June, 2011
SST Taiwan – Chinese version of "Wet-process technologies for scalable through-silicon vias" – 可調整式矽穿孔的濕式製程技術 (for VIEWING ONLY)
May 30, 2011
3D Incites - Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s Applications
April 5, 2011
3D Incites - Alchimer’s Taiwanese Expansion Emphasizes Total Solution Strategy
April 8, 2011
SST podcast and article - Electrografting fills high-aspect ratio TSV
April 2011
Semiconductor Manufacturing & Design - Alchimer’s Challenge
April 2011
SST Print edition – Cover story (for VIEWING ONLY)
Wet-process technologies for scalable through-silicon vias Electrografting nanotechnology has been optimized for highly conformal growth of TSV films, enabling a large reduction in cost-of-ownership per wafer compared to the dry process approach. Claudio Truzzi, Alchimer S.A., Massy, France
February 2011
Yole's 3D Packaging Magazine - 3DICs bring opportunities, challenges
February 2011
Yole's 3D Packaging Magazine - Alchimer on 3D interconnects
January / February 2011
Chip Scale Review - Alchimer: Thumbs up from RTI
January 1, 2011
Solid State Technology & Electro IQ - 22nm: the node of diminishing returns?
January 2011
SEMI China Newsletter —— 访Alchimer CEO Steve Lerner
October 18, 2010
3D Incites - Alchimer in Asia: Things are Cooking
October 2010
Solid State Technology - Forging a TSV supply chain in a consolidated market
August 9, 2010
I-Micronews - Alchimer Workshop at Semicon 2010
August 2010
Solid State Technology – 3D Activity at SEMICON West
August 2010
Solid State Technology – Product News
July 26, 2010
EE Times - CEOs: Still room for fab tool startups
July 16, 2010
EE Times - SEMICON: Alchimer seeks to disrupt PVD market
December 31st 2009
Perspectives from the Leading Edge.
November 3rd 2009
3D Incites
November 2nd 2009
Alchimer’s AquiVia product has been integrated into Yole Developpement’s TSV CoSim+: TSV Manufacturing Cost Simulation Tool . Click here for the Webdemo presentation.
October 30, 2009
Future Fab International – Electrografting: Unlocking High-Aspect-Ratio TSVs.
October 23, 2009
Perspectives from the Leading Edge
September 29, 2009
Alchimer presents a paper at the IEEE International Conference on 3D System Integration (3D IC) , September 28-30, 2009, San Francisco, California, USA: Wet-Process Deposition of TSV Liner and Metal Films
September 25, 2009
Forum Discussion on 3D Incites
July 26, 2009
Perspectives from the Leading Edge
July 20, 2009
Alchimer wins 2009 R&D 100 Award for eG ViaCoat™ product
June 20, 2009
Perspectives from the Leading Edge
May 29, 2009
Alchimer presented a paper at ECTC 2009 in San Diego: Electrografted Seed Layers for Metallization of Deep TSV Structures.
May 14, 2009
Alchimer CTO Dr. Claudio Truzzi has been invited to speak at the 7th Annual MEPTEC MEMS Symposium, "MEMS Innovation – Growth Engine In Rich and Lean Times" conference to be held on Thursday, May 14 at the Wyndham hotel in San Jose
February 2, 2009
Steve Lerner, CEO of Alchimer, talks to Françoise von Trapp about the company’s successes in 2008.
Read the full interview: 3D Start-up Alchimer Poised for Success
January 20, 2009
Alchimer was invited to speak at the “Electropackage System and Interconnect Product” Symposium during Semicon Korea 2009 in Seoul, and presented the paper “A novel approach to TSV metallization based on electrografted layers”