Alchimer offers a suite of products that bring Electrografting’s breakthrough results to the manufacturing line. All our products offer a combination of conformality, step coverage and purity that cannot be matched by dry processes. Customers may choose a single film or any combination of films and fills, based on their application needs.

AquiVia Iso –AquiVia Iso provides an isolation film for the dielectric liner. We use a polymer with an elasticity modulus and stress value that provide a thermo-mechanical buffer between Si and Cu. The Electrografting technology allows the polymer chains to form a very dense and compact film with superior electrical properties.

AquiVia Barrier – AquiVia Barrier utilizes a NiB compound to create barrier properties equivalent to TiN and Cu and the diffusion characteristics of Ta/TaN, while maintaining resistivity levels that enable fill without the need for a Cu seed layer.

AquiVia Seed – AquiVia Seed deposits extremely high-quality Cu seed layers.  It provides all the advantages of the Electrografting technology in applications where a seed layer is desirable.

AquiVia Fill – AquiVia Fill provides the final fill step for deep-and-narrow through-silicon vias. It provides larger and more uniform grain sizes than industry-standard processes, and because it does not require additives typical of standard ECD fills, the purity of the bath is significantly higher.

AquiVantage – AquiVantage uses the same cost-saving technology as Alchimer’s wet processes for TSV. It is an all-encompassing process that provides extremely high-quality films and grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. It marks a fundamental shift in the construction of interposer for 3D chip packages by eliminating several process steps, including two costly photolithography steps.

AquiVia Deposition Systems – Alchimer offers approved wet-deposition systems that can meet the requirements of any application, from a single film step to an automated full stack and fill application. The full-system solution can be achieved in one tool that typically cuts costs by 60 percent compared to standard dry set-ups, while also significantly reducing the hardware footprint.

AquiVia-Approved Tools – Alchimer’s processes are easily implemented on a variety of wet systems. This gives our customers the flexibility to use existing depreciated tools that may already be at their facilities. Alchimer works with customers to optimize these tools for our process.