Electrografting (eG™) is a breakthrough molecular-engineering technology that dramatically reduces costs and increases yields in 3D IC and on-chip interconnect. This electrochemical-based process uses specific organic precursors that enable ultra-conformal growth of dielectric and conductive nanometric films from aqueous chemistries.

Using industry-standard electroplating equipment, the substrate surface is exposed to liquid chemical precursors of the desired film. Electrons from the biased surface serve as “bonding seeds” for a large number of precursor molecules. In this way, the process initiates the growth of the film — grafting it onto the surface — with the formation of a strong chemical bond between the first seeded precursor and the surface.

eG delivers nanometer-scale thickness control from two to 500nm, unrivalled uniformity at wafer scale, and conformal coating on patterned surfaces, even at aspect ratios as high as 20:1.