At every step of the electronics value chain, from wafer fab to packaging to board stuffing, manufacturers seek to meet market demands by striking the ideal balance between advanced technology, economics, and process robustness.

Alchimer’s Electrografting (eG) and Chemicalgrafting (cG™) deposition processes represent a rare instance of positive impact in each of those three areas.

On the technology front, eG and cG have unmatched ability to deposit top-quality films over extremely demanding topography. Because they are wet processes, they can conformally coat features like through-silicon vias with aspect ratios of 10:1 or 20:1, or challenging MEMS substrates.

On the economic and process sides, eG and cG are a liberation from expensive and cumbersome vacuum-based processes. Up-front capital costs are slashed, because eG and cG can even utilize industry-standard wet benches rather than costly proprietary cluster tool platforms. Cost of ownership is also outstanding, with high uptime, throughput, and yield.

Bottom line: processes that reduce your production costs by up to 75 percent compared to traditional vacuum-based methods. That’s the power of Alchimer’s molecular expertise.