All around us, in communications, health care, lighting, power production, and other fields, electronic devices are transmitting, storing, and manipulating massive quantities of electrical information.

Every bit of that information, and every watt of power used by those devices, is carried over microscopic wiring networks of extreme complexity. Whether on silicon wafers, in stacked chip arrays, or on flexible circuit boards, this wiring is composed of ultra-pure, ultra-high-quality films of metal, insulation, and other materials.

For decades, vapor-phase deposition processes have been the method of choice for creating these wiring networks, despite their expense, complexity, and process limitations. But now there is a better way – Alchimer’s Electrografting (eG™) and Chemicalgrafting (cG™) processes.

Both processes build on Alchimer’s unique, IP-protected ability to bond materials using molecular forces. This bonding, and subsequent deposition of material, occurs in a liquid bath, rather than a vacuum chamber, and confers huge cost advantages (up to 75 percent less expensive than physical vapor deposition), while also delivering superior film quality in demanding leading-edge applications.

Alchimer processes provide a perfect technological and economic solution for manufacturing the world’s most advanced devices.