Alchimer



Low Cost Wet Deposition Technology for
Advanced TSV Metallization

Through Silicon Vias (TSVs) are the foundation of the 3D-IC revolution and are a key enabler for extending semiconductor integration trends into a new phase. Integrated Device Manufacturers and fabless design houses need small, high-density, unobtrusive vias for improved signal integrity and Si real-estate availability.

TSVs cannot be manufactured with acceptable yield/cost using traditional dry processes for liner, barrier and seed deposition. Chemical and Physical Vapor Deposition techniques show basic shortcomings and impose high capital investments, holding back the industry-wide adoption of 3D-IC solutions.

Electrografting (eG™) is a molecular engineering technology delivering high-quality films for high-aspect ratio TSVs at a reduced cost as compared to conventional dry methods. Electrografting generates surface-initiated conformal films which are thin, continuous, adherent and uniform. It is a wet-process technique, operated in standard, widely available plating tools.

Alchimer has recently announced the release of AquiVia XS, a seedless metallization technology which eliminates one of three metallization steps allowing TSVs to be manufactured at an even lower cost than previously possible. Cost-of-ownership analysis for a typical 5 x 50 µm TSV shows an 80 percent improvement over the traditional dry process stack.

Latest news

February 4th 2010
Alchimer Opens 300mm Applications-and-Development Facility in Asia

February 4th 2010
Alchimer Signs Far-Reaching Agreement with KPM Tech, South Korean Chemical and Equipment Manufacturer

December 2nd 2009
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process

 
Best of West 2009 Best of West R&D100 APA Finalist Award Awards