Through Silicon Vias (TSVs) are the foundation of the 3D-IC revolution and are a key enabler for extending semiconductor integration trends into a new phase. Integrated Device Manufacturers and fabless design houses need small, high-density, unobtrusive vias for improved signal integrity and Si real-estate availability.
TSVs cannot be manufactured with acceptable yield/cost using traditional dry processes for liner, barrier and seed deposition. Chemical and Physical Vapor Deposition techniques show basic shortcomings and impose high capital investments, holding back the industry-wide adoption of 3D-IC solutions.
Electrografting (eG™) is a molecular engineering technology delivering high-quality films for high-aspect ratio TSVs at a reduced cost as compared to conventional dry methods. Electrografting generates surface-initiated conformal films which are thin, continuous, adherent and uniform. It is a wet-process technique, operated in standard, widely available plating tools.
Alchimer has recently announced the release of AquiVia XS, a seedless metallization technology which eliminates one of three metallization steps allowing TSVs to be manufactured at an even lower cost than previously possible. Cost-of-ownership analysis for a typical 5 x 50 µm TSV shows an 80 percent improvement over the traditional dry process stack.
Latest news
February 4th 2010
Alchimer Opens 300mm Applications-and-Development Facility in Asia
February 4th 2010
Alchimer Signs Far-Reaching Agreement with KPM Tech, South Korean Chemical and Equipment Manufacturer
December 2nd 2009
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process
