Press releases
July 12th 2010
Alchimer Receives Equity Investment From Panasonic Corporation
June 22nd 2010
AquiVia Fill Sets New Standards for Metallization Process
Of the Most Advanced Through-Silicon Vias
April 7th 2010
Bill Bottoms, Veteran Chip Industry Executive, Investor and Entrepreneur Joins Alchimer Board
March 9th 2010
Alchimer Opens 300mm Applications-and-Development Facility in Asia
February 4th 2010
Alchimer Signs Far-Reaching Agreement with KPM Tech, South Korean Chemical and Equipment Manufacturer
December 2nd 2009
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process
November 3rd 2009
Alchimer Quantifies Payoff of High-Aspect-Ratio TSVs: Move from 5:1 to 20:1 Can Save Over $700/Wafer by Reducing Space Needs | 中文 | 日本語
July 9th 2009
Alchimer Introduces Cost-saving AquiVia™ Deposition Process For Advanced TSV Metallization | 中文 | 日本語
June 23nd 2009
Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development | 中文1 | 中文2 | 日本語
June 17th 2009
Alchimer a finalist for “Best of West” award
June 10th 2009
Alchimer’s Enhanced eG ViaCoat Achieves up to 80 Percent Reduction
In Cost of Ownership for TSV Copper Seed | 中文1 | 中文2 | 日本語
In the news
December 31st 2009
Perspectives from the Leading Edge
November 3rd 2009
3D Incites
November 2nd 2009
Alchimer’s AquiVia product has been integrated into Yole Developpement’s TSV CoSim+: TSV Manufacturing Cost Simulation Tool . Click here for the Webdemo presentation.
October 30th 2009
Future Fab International – Electrografting: Unlocking High-Aspect-Ratio TSVs
Events
March 9th 2010
Alchimer presents a paper at the 6th International Conference and Exhibition on Device Packaging, March 8-11, 2010, Scottsdale, Arizona, USA: Integration of Electrografted Layers for the Metallization of Deep TSVs
March 12th 2010
Claudio Truzzi presents paper at DATE Conference in Dresden on March 12th