News releases
September 6, 2011
Alchimer揭露矽穿孔阻障膜技術的重大進步；階梯覆蓋率達100%，提升填充速度和品質 (Traditional Chinese)
アルキメルがTSVバリア層における大きな成果を発表：ステップカバレッジ100パーセントが埋め込みスピードを上げ品質を高めます (Japanese)
Alchimer披露硅穿孔阻拦膜技术的重大进步；阶梯覆盖率达100%，提升填充速度和质量 (Simplified Chinese)
May 18, 2011
Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging
Alchimer 對應 3D 封裝之 Interposer及Via Last 推出先進金屬化製程 (Traditional Chinese)
March 31, 2011
Alchimer Continues Asian Expansion Through Agreement with Kromax in Taiwan
Alchimer 與奇裕企業簽定台灣地區代理合約並持續亞洲地區的擴展 (Traditional Chinese)
March 1, 2011
微電子創新協作中心獲准將Alchimer的濕沉降產品用於MEMS 3D研究 (Traditional Chinese)
微电子创新协作中心获准将Alchimer的湿沉降产品用于MEMS 3D研究 (Simplified Chinese)
マイクロエレクトロニクス・イノベーション提携センターがMEMS 3D研究でアルキメル製湿式成膜製品の使用権を取得 (Japanese)
미세전자 혁신 협력센터, MEMS 3차원 연구 위해 알카이머 습식증착 제품 라이선스 구매 (Korean)
November 30, 2010
RTI International Validates Alchimer’s Electrografting Technology For 3D TSV Applications
October 12, 2010
Alchimer 社と薬液製造ライセンス契約締結のお知らせ (Japanese version)
July 12, 2010
Alchimer Receives Equity Investment From Panasonic Corporation
アルキメルにパナソニックが出資 (Japanese)
Alchimer从松下公司获得股权投资 (Simplified Chinese)
Alchimer從松下公司獲得股權投資 (Traditional Chinese)
June 22, 2010
AquiVia Fill Sets New Standards for Metallization Process Of the Most Advanced Through-Silicon Vias
March 9, 2010
Alchimer Opens 300mm Applications-and-Development Facility in Asia
February 4, 2010
December 2, 2009
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process
July 9, 2009
Alchimer Introduces Cost-saving AquiVia™ Deposition Process For Advanced TSV Metallization
June 23, 2009
Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development
June 17, 2009
Alchimer a finalist for “Best of West” award
June 10 2009