Press releases
Alchimer launches high aspect ratio TSV metallization product, eG ViaCoat, with cost of ownership 75% less than PVD
Wet electrochemical process is easy to implement on existing electroplating tools
27th May, Massy, France: Alchimer S.A. has launched eG ViaCoatTM, the latest in its eGTM series of electrochemical coating processes, for the metallization of high aspect ratio through-silicon vias (TSVs) used in advanced 3D packaging applications. eG ViaCoat produces conformal, thin, uniform and adherent copper seed layers, even on resistive barriers. It enables significant reductions in cost of ownership (CoO) compared to dry vacuum processes. For example, for 10:1 aspect ratio TSVs, the CoO of eG ViaCoat is 75% less than that of a traditional PVD (physical vapor deposition) process. The cost advantage increases further at higher aspect ratios and eG ViaCoat can be applied using existing industry-standard copper electroplating equipment, eliminating new capital expenditure.
Typical PVD processes have already reached their limitations in terms of producing continuous layers for vias with aspect ratios of 5:1. eG ViaCoat demonstrates conformal sidewall and bottom coverage, even when deposited on discontinuous surfaces such as highly ‘scalloped’ TSV etch profiles. It is compatible with standard barrier materials, including, but not limited to, PVD, CVD and ALD deposited Ta, TaN, Ti, TiN, WN, Ru and bi-layers.
“Due to its ability to cope with even the most aggressive TSV aspect ratios, eG ViaCoat is the only copper seed layer technology that enables TSVs to keep up with the 3D IC packaging roadmap,” comments Dan Marx, VP of Business Development at Alchimer. “eG ViaCoat is supported by Alchimer’s strong portfolio of 25 patents and patent applications.”
eG ViaCoat is based on Alchimer's proprietary electrografting technology. Electrografting (eGTM) is an electrochemical process based on specific organic precursors enabling the initiation and growth of nanometric films on conductive or semiconducting surfaces.
eG ViaCoat is suitable for all applications requiring Cu metallization of TSVs: high-density vias for 3D-ICs such as stacking of memories, medium and low-density vias for image sensors, heterogeneous components integration and System-in-Package applications.