Press releases

Alchimer announces participation in the CUMIN project to create 3D interconnects for System-in-Package chips

Massy, France, January 1st 2007: Alchimer announces it is participating in the CUMIN (CUivre pour les interconnexions entre MIcro et Nano systèmes) project supported by Agence Nationale de la Recherche (ANR PNANO 06-044).

The CUMIN project, based in France, aims to develop innovative chemicals and process strategies in order to enable interconnection between passive (micro) and active (nano) components in a single package. This is to be achieved specifically by developing 3D copper interconnects for silicon-based system-in-packaging (SiP) chips, to replace traditional wire bonding methods.

Challenges associated with creating such interconnects for the SiP architecture include the necessary high aspect ratios, via depths of up to several microns and low ohmic resistances. New chemicals and electrochemical methodologies are therefore required for this new type of 3D interconnections.

Participants in the project are NXP Semiconductors, OM Group Ultra Pure Chemicals, Alchimer and the academic institute IREM Lavoisier. The project starts with a development and industrialisation phase of 24 months, during which top-down and bottom-up strategies will be developed simultaneously in order to fully address the scientific and industrial challenges. The CUMIN project should thus enable each partner to develop its own IP and materials for addressing the fast-growing SiP market with production-ready solutions.