Press releases
Alchimer appoints Lenix as Korean representation for its TSV metallisation technology
10 June 2008, Massy, France: Alchimer, the nanometric films for through-silicon via (TSV) metallisation company, has appointed Lenix as its representative in Korea. This exclusive agreement means Lenix is sole agent for Alchimer's products in Korea.
Available from Lenix are the formulations and process IP for Alchimer's electrochemical deposition process for nanometric films in through silicon vias (TSVs). The technology, developed to overcome the limitations of vapor deposition processes, is known as Electrografting (eG™). eG™ provides nanometer scale thickness control from 2 to 500nm, best-in-class uniformity at wafer scale, and conformal coating on patterned surfaces, even at aspect ratios of 10:1 or more. It is a wet process that promises substantial cost reductions, including halving the cost of processing wafers for high aspect ratio TSVs.
Alchimer technology is easily transferable to industry-standard process lines, so there is no need for investment in new capital equipment.
The latest product to be announced by Alchimer is eG ViaCoat™, for creating conformal copper seed layers inside high aspect ratio TSVs.
Lenix is owned and run by semiconductor industry veteran Sang-Sok Lee, President and CEO. Lee created Lenix earlier this year to focus on advanced 3D packaging and TSV technology. The company is also provides Carrier Tape as the final packing media of packaged ICs. Lee has more than 25 years' experience in back-end-of-line processing technology, and is currently also an advisor for several Korean based companies.
Alchimer CEO Steve Lerner comments: "We are very happy to announce that we have appointed Lenix as our Korean rep. Sang-Sok Lee brings a wealth of experience in this sector and through this partnership, we are certain that Alchimer's TSV metallisation technology will be extremely successful in the Korean marketplace."