Press releases
Alchimer co-authors a paper at Materials for Advanced Metallization Conference 2008
Dresden, Germany, March 2nd 2008: Alchimer has co-authored a paper that will be presented at the Materials for Advanced Metallization Conference (MAM 2008) in Dresden, Germany, today.
The title of the paper is "High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed". It highlights Alchimer's electrografting technique as enabling the growth of extremely conformal copper seed layers with good step coverage for through-silicon vias with standard plating equipment.
The paper has been co-authored with colleagues from ST Microelectronics, ASM Belgium and IMEC.
MAM 2008 is the 17th in a series devoted to materials research, materials properties and interactions. Starting as workshop on refractory metals and silicides in the 80s, moving to materials for advanced metallization in 1995, this year's workshop will include a number of new and challenging topics in the field of materials and structures for advanced micro- and nanoelectronics. Topics include both fundamental and applied research, as well as issues related to introduction into manufacturing.
For more information on MAM 2008 please visit: www.mam-conference.org
To download the paper, please register.