Press releases
Alchimer announces sponsorship of the 3-D architectures for semiconductor integration and packaging conference 2007
Massy, France, 1st September 2007: Alchimer announces its sponsorship of the
3-D architectures for semiconductor integration and packaging conference.
On the Alchimer booth, the company will be showcasing its electrografting
eG™ technology for creating copper seed layers. Electrografting has the
unique ability to deposit ultra-thin, uniform, adherent and conformal copper
seed layers in a wet approach and is fully compatible with commercial copper
electroplating blend waste stream and tool sets. It combines enabling
performances and cost-effectiveness compared to high-cost vapour phase
deposition techniques.
The conference is devoted to leading-edge research in the field of advanced
metallization and 3D integration for ULSI IC applications. The objective of
the meeting is to provide a forum for open discussion of critical issues
affecting state-of-the-art and future directions in interconnect systems.
Topics include both fundamental and applied research, as well as advanced
interconnect materials issues, introduction to manufacturing, unit process
development, full integration data, interconnect reliability, and IC wiring
scaling.
The conference will be held at the Hyatt Regency San Francisco Airport
Hotel, Burlingame, CA, October 22 to 24th.