Press releases
Alchimer co-founder and CEO Christophe Bureau invited to speak at AMC 2007
Albany, NY, October 9th 2007: Alchimer co-founder and CEO Christophe Bureau has been invited to speak at the Advanced Metallization Conference 2007 in Albany, NY.
Bureau will present his paper "From Copper Seed Layers to the All Wet: Electrografting (eG™) at Work for Advanced Copper Interconnects", which details how Alchimer's electrografting technology will eliminate all dry processes from copper interconnects and TSV metallization.
The Advanced Metallization Conference is devoted to leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications. The objective of the meeting is to provide a forum for open discussion of critical issues affecting state-of-the-art and future directions in interconnect systems. Topics include both fundamental and applied research, as well as advanced interconnect materials issues, introduction to manufacturing, unit process development, full integration data, interconnect reliability, and IC wiring scaling.
To download Christophe Bureau's paper and other Alchimer technical papers, please register.