In the news archive
October 23rd 2009
Perspectives from the Leading Edge
September 29th 2009
Alchimer presents a paper at the IEEE International Conference on 3D System Integration (3D IC) , September 28-30, 2009, San Francisco, California, USA: Wet-Process Deposition of TSV Liner and Metal Films
September 25th 2009
Forum Discussion on 3D Incites
July 26th 2009
Perspectives from the Leading Edge
July 20th 2009
Alchimer wins 2009 R&D 100 Award for eG ViaCoat™ product
June 20th 2009
Perspectives from the Leading Edge
May 29th 2009
Alchimer presented a paper at ECTC 2009 in San Diego: Electrografted Seed Layers for Metallization of Deep TSV Structures.
May 14th 2009
Alchimer CTO Dr. Claudio Truzzi has been invited to speak at the 7th Annual MEPTEC MEMS Symposium, "MEMS Innovation – Growth Engine In Rich and Lean Times" conference to be held on Thursday, May 14 at the Wyndham hotel in San Jose
February 2nd 2009
Steve Lerner, CEO of Alchimer, talks to Françoise von Trapp about the company’s successes in 2008.
Read the full interview: 3D Start-up Alchimer Poised for Success
January 20th 2009
Alchimer was invited to speak at the “Electropackage System and Interconnect Product” Symposium during Semicon Korea 2009 in Seoul, and presented the paper “A novel approach to TSV metallization based on electrografted layers”
December 29th 2008
Alchimer’s eG ViaCoat selected as the ‘Top new product of 2008’ at www.fabtech.org
December 3rd 2008
Alchimer was invited to speak at the MRS Fall meeting in Boston, MA, December 1-5. Alchimer presented the paper “Through Silicon Via metallization: A novel approach for insulation/barrier/copper seed layer deposition based on wet electrografting and chemical grafting technologies”.
19 November 2008
Alchimer CTO Dr. Claudio Truzzi invited to be a panellist at “3-D Architecture for Semiconductor Integration and Packaging” conference, organized by RTI in Burlingame, California December 3rd 2008
Alchimer has been announced as a finalist in the 3D Packaging category of the Advanced Packaging Awards! The winners will be announced at Semicon West 2008.
Alchimer has made it to the final round of the EuroAsia Semiconductor Awards 2008 – please click here to vote for Alchimer!
June 2006
Micro Magazine – "Copper Seed Layer"
November 1st 2007
Semiconductor International – “Electrografting proposed for Cu seed layers”.
January 12th 2006:
Alchimer's electrografting (eG™) technology enters the ITRS (International Technology Roadmap for Semiconductors), 2005 edition as one of the leading solutions for Copper Seed Layer processing (eG™ Seed) for ULSI in semiconductor manufacturing.
April 14th 2003
Les Echos – Alchimer technologies as true alternatives in the struggle for the ultimate reduction in size in microelectronics.