Press release archive
December 15th 2008
DALSA Semiconductor to license Alchimer's eG ViaCoat™ technology for MEMS processes with copper through-silicon vias | 한국어 | 中文
October 9th 2008
Alchimer selected to present at the European Tech Tour Semiconductor Summit 2008
September 25th 2008
Alchimer CTO Dr. Claudio Truzzi invited to speak at the “Manufacturing and Reliability Challenges for 3D ICs using TSVs” Workshop organized by Sematech in San Diego, California
September 18th 2008
IC packaging expert Dr. Claudio Truzzi appointed CTO of Alchimer
July 17th 2008
Alchimer wins 'Best of the West' Award at SEMICON West 2008
July 15th 2008
Alchimer's AquiVia electrochemical process puts the squeeze on PVD by halving TSV layer deposition costs
June 12th 2008
Alchimer a finalist for “Best of West” award
June 10th 2008
Alchimer appoints Lenix as Korean representation for its TSV metallisation technology
May 27th 2008
Alchimer launches high aspect ratio TSV metallization product, eG ViaCoat, with cost of ownership 75% less than PVD
March 17th 2008
New Alchimer CEO, Steve Lerner, predicts the demise of vapor deposition processes for through silicon vias by 2009
March 2nd 2008
Alchimer co-authors a paper at Materials for Advanced Metallization Conference 2008
October 9th 2007
Alchimer co-founder and CEO Christophe Bureau invited to speak at AMC 2007
1st September 2007
Alchimer announces sponsorship of the 3-D architectures for semiconductor integration and packaging conference 2007
January 1st 2007
Alchimer announces participation in the CUMIN project to create 3D interconnects for System-in-Package chips
June 5th 2006
Alchimer Introduces ALC-S200 for Ultra-thin electrografted ( eG™ ) Seed Process
August 18th 2005
Alchimer announces the launch of its manufacturing pilot line in Massy.
June 21st 2005
Alchimer welcomes Intel Capital in an extension of its second round of funding.
April 1st 2005
Alchimer in the short-list of the "Red Herring 100 Europe Awards".
December 13th 2004
Alchimer is present at the IEDM Congress in San Francisco, where TSMC presents the first integration results on 45 nm Cu BEOL using electro-grafted Cu seeds.
November 9th 2004
Alchimer welcomes Auriga Partners, Partech International and FCJE in a 11 M€ second round of funding.
April 2004
Alchimer joins new 900 m² facility in Massy, France, enlarging its capacity for product development, surface analysis and process engineering of its technology.
March 2002
Alchimer completes a pre-funding agreement with CEA and CEA-Valorisation, granting Alchimer an exclusive worldwide licence on all CEA patents and know-how related to the technology of electro-grafting.
September 17th 2001
Roger- Gérard Schwartzenberg, French Minister of Research and Industry, awards Alchimer the First National Award for the Creation of High-Tech Companies.
August 13th 2001
Christophe Bureau PhD and François Breniaux, both from the Commissariat à l'Energie Atomique (CEA, France) create Alchimer S.A., a company specialised in the functionnalisation of surfaces, based on personal funding.