Products and support for process development to dramatically cut costs
Alchimer has developed several ground breaking products, based on eG™ technology, that will dramatically reduce costs and increase yields in silicon wafer and 3D IC manufacturing. Here are two of them:
eG Seed™ is an electro-grafted Cu seed layer technology that makes it possible to create reliable interconnects at 45nm node and beyond. The technology ensures over 90% Cu seed step coverage and precise thickness control from 5 to 30nm. Resistivity is 10µOhm.cm at 10nm.
eG ViaCoat™ is the enabling technology for the metallization of TSVs used in advanced 3D packaging applications. 3D chip stacking delivers reduced size, cost, and power consumption, while increasing both functionality and performance. For vias from 3 to 150µm in diameter, continuous Cu seed layers from 50 to 500nm can be created, with typical resistivity of 1.8µOhm.cm at 500nm.
Both eG Seed™ and eG ViaCoat™ are easy to implement and compatible with most barrier layers.
Process development services are available to assist customers with expanding the capabilities of existing electroplating tools, often eliminating the need for capital expenditure on PVD tools.
More breakthrough products will be launched during 2008, all of which will further drive down costs and improve quality and performance in semiconductor manufacturing. To receive priority information about these products as they are announced, or to download more technical details on eG Seed™ and eG ViaCoat™ please register.
