Products and support for process development to dramatically cut costs
Alchimer has developed several ground breaking products, based on eG™ technology, that will dramatically reduce costs and increase yields in silicon wafer and 3D IC manufacturing.
eG Seed™is an electrografted Cu seed layer to create reliable interconnects. It provides conformal, ultra-thin, uniform and adherent copper seed layers for the metallization of advanced interconnects (45nm node and beyond).
Ultra-thin and conformal copper seed layers can be deposited on various barrier materials with very high adhesion and low resistivity. The technology ensures 90% step coverage and precise thickness control from 5 to 30nm. Resistivity is 10µOhm.cm at 10nm.
A unique benefit of eG Seed™ over PVD is its outstanding coverage of dual damascene structures, for higher yield and enhanced reliability.
eG ViaCoat™ is an electrografted Cu seed layer for the metallization of Through Silicon Vias (TSVs) used in advanced 3D packaging applications. It provides conformal, thin, uniform and adherent copper seed layers.
Low-resistivity copper seed layers in the 50 to 500 nanometer range can be deposited on various barrier materials with very high adhesion. Continuous coverage of high aspect ratio (18:1) TSVs is achieved, enabling subsequent void-free Cu filling of vias.
A unique benefit of eG ViaCoat™ is its capability of depositing continuous and smooth seed layers over highly scalloped TSVs, for higher yield and enhanced reliability.
AquiVia™ encompasses the three distinct process steps required before a TSV can be filled with metal. It enables wet-process deposition of isolation, barrier and copper seed layers within high aspect ratio (18:1) TSVs.
A unique benefit of AquiVia is its strong adhesion: The chemical formulations and processes have been specifically tailored to promote covalent bonding between the layers and with the substrate, ensuring strong adhesion of all layers to the substrate.
AquiVia enables deposition of smooth and continuous layers over highly scalloped TSVs, for higher yield and enhanced reliability.
Both eG Seed™, eG ViaCoat™ and AquiVia™ are easy to implement and provide cost-effectiveness compared to high-cost vapor phase deposition techniques. Chemistries are ready-to-use aqueous solutions. Formulations and process recipes are readily compatible with most electroplating tools.
Process development services are available to assist customers with expanding the capabilities of existing electroplating tools, often eliminating the need for capital expenditure on PVD tools.
To download more technical details on eG Seed™, eG ViaCoat™ and AquiVia™ please register.
