Alchimer has developed several ground breaking products, based on eG™ technology, that will dramatically reduce costs and increase yields in silicon wafer and 3D IC manufacturing.
Electrografting (eG™ ) is Alchimer’s breakthrough molecular engineering technology. By combining unique chemical formulations and processes to engineer self-oriented nanometric films, various materials can be deposited on conducting and semi-conducting substrates. Chemical grafting (cG™) is based on the same fundamental mechanisms and is used on non-conductive substrates.
AquiVia™ XS and AquiVia™ Fill encompasses the three distinct process steps required to fill a Through Silicon Via (TSV) with metal. They enable wet-process deposition of isolation, barrier and copper fill within high-aspect-ratio (>20:1) TSVs.
AquiVia XS consists of eG™ Isolation for the dielectric liner and cG™ Barrier for the diffusion barrier. By eliminating the copper seed layer from the standard isolation-barrier-seed process flow, AquiVia XS allows TSV metal fill to take place directly after application of the barrier layer.
AquiVia Fill is an innovative, high-purity TSV-grade copper plating chemistry, specifically formulated to fill high-aspect-ratio TSVs.
The complete TSV Metallization stack (AquiVia XS and AquiVia Fill) can now be implemented on a single electroplating tool, delivering a cost effective solution with a significant CoO advantage compared to vapor phase technologies (PVD, CVD and ALD).
eG ViaCoat™ consists of one process step – the copper seed layer used in TSV metallization.
eG Seed™ consists of one process step as well – the copper seed layer used in advanced interconnect manufacturing.
eG Seed, eG ViaCoat, AquiVia XS and AquiVia Fill are easy to implement and provide cost-effectiveness compared to high-cost vapor phase deposition techniques. Chemistries are ready-to-use and easy to monitor. Formulations and process recipes are readily compatible with most electroplating tools.
Process development services are available to assist customers with expanding the capabilities of existing electroplating tools, often eliminating the need for capital expenditure on PVD tools.
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