AquiVia™ XS consists of eG™ Isolation for the dielectric liner and cG™ Barrier for the diffusion barrier. This unique product enables wet-process deposition of isolation and barrier layers within high-aspect-ratio Through Silicon Vias (TSVs).
Electrografting is Alchimer’s breakthrough molecular engineering technology, enabling the deposition of eG™ Isolation. By combining unique chemical formulations and processes to engineer self-oriented nanometric films, AquiVia XS can be deposited on conducting and semi-conducting substrates. Chemical grafting of cG™ Barrier is based on the same fundamental mechanisms and is used on non-conductive substrates.
AquiVia XS chemistries are ready-to-use and easy to monitor. Formulations and process recipes are fully compatible with most standard electroplating tools. The complete TSV Metallization stack (eG™ Isolation, cG™ Barrier and AquiVia™ Fill) can now be implemented on a single electroplating tool. AquiVia XS further expands Alchimer’s cost-of-ownership advantages over dry deposition technologies.
