eG ViaCoat™ is an electrografted Cu seed layer for the metallization of Through Silicon Vias (TSVs) used in advanced 3D packaging applications. It provides conformal, thin, uniform and adherent copper seed layers.
Low-resistivity copper seed layers in the 50 to 500 nanometer range can be deposited on various barrier materials with very high adhesion. Continuous coverage of high aspect ratio (>20:1) TSVs is achieved, enabling subsequent void-free Cu filling of vias.
A unique benefit of eG ViaCoat™ is its capability of depositing continuous and smooth seed layers over highly scalloped TSVs, for higher yield and enhanced reliability.
