Alchimer’s metallization technology provides similar metallization advantages for a large variety of commonly used microelectronic substrates:

• High adhesion
• High resistance to thermal and bending stress
• Straightforward wet process- no vacuum required
• Lower costs

LTCC
Low-temperature co-fired ceramic (LTCC) is a well-established multi-layer technology for RF and high-frequency packaging. Alchimer’s metallization technology enables cost-effective deposition of LTCC barrier layers with very high adhesion values, and the ability to withstand processing at over 500 °C.

BT Resin
Used to package and connect most chips used in mobile applications, BT resin faces conflicting market demands for both lower cost and thinner substrates with narrower traces. Alchimer’s fluid-based technology enables finer lines with high adhesion values while lowering cost of ownership.

Flex
Flexible substrates are ubiquitous. Traditionally, metal traces are laminated together with the substrate body, but manufacturers are moving beyond lamination for finer pitch and better precision. While vacuum-based dry deposition is one option, Alchimer’s technology allows deposition of metal films with higher adhesion at a fraction of the cost.