The migration to increasingly complex devices and More Than Moore technologies has exposed the technological limitations and cost-of-ownership drawbacks of legacy dry-deposition systems.

Alchimer’s wet technology addresses both these concerns. Our patented chemistries and deposition techniques provide better films and fills than standard processes, while cutting costs in half. Alchimer’s elegant controlled molecular-growth process eliminates the brute force and inefficiencies of dry processes.

Electrografting (eG™) is Alchimer’s breakthrough molecular-engineering technology that dramatically reduces costs and increases yields in silicon wafer and 3D IC manufacturing.

It is a wet, electrochemical process that enables the growth of extremely high-quality polymer and metal thin films on both conducting and semiconducting surfaces. eG reduces overall cost of ownership for high-aspect-ratio TSV metallization by up to two-thirds compared to conventional dry processes, and shortens time to market.

Chemicalgrafting (cG™) is based on the same fundamental mechanisms and is used on non-conductive substrates. It is a unique electroless process sequence that enables the growth of highly adherent, low-resistivity copper-diffusion barrier films on isolating surfaces through the formation of strong chemical bonds between the films.

Both wet-process techniques are hardware-independent, and can be performed in widely available, industry-standard plating tools.